If the high heat generated by electronic equipment during operation cannot be dissipated in time, it will seriously affect the performance and service life. The heat dissipation design of non-standard customized plastic shell needs to break through the limitations of the poor thermal conductivity of the material itself, and start from structural innovation, technology integration and other aspects to build an efficient heat dissipation system for the equipment.
Optimizing the shell structure is the basis for improving heat dissipation capacity. Non-standard customized plastic shell can promote air circulation by designing special heat dissipation channels. For example, reasonably arranged heat dissipation holes are opened on the surface of the shell. The size, shape and distribution of these holes are carefully planned to ensure sufficient ventilation and take into account the strength and protection of the shell. In addition, a guide groove can be set inside the shell to guide the air to flow along a specific path to form an orderly air duct. When the air flows in the air duct, it can continuously take away the heat generated by the electronic equipment and transfer it to the external environment to achieve effective heat dissipation. Through this structural optimization, even if the plastic itself has poor thermal conductivity, the heat dissipation efficiency can be improved with the help of air flow.
Adding heat dissipation auxiliary components is an important means to enhance the heat dissipation effect. In the non-standard customized plastic shell, a heat sink can be installed to increase the heat dissipation area. Heat sinks are usually made of metal materials with good thermal conductivity, such as aluminum or copper. They can quickly absorb the heat emitted by electronic devices and transfer the heat to the surrounding air through their large surface area. In order to make the heat sink fit tightly with the heating part of the device, thermal conductive silicone grease is also used to fill the tiny gap between the two to reduce thermal resistance and improve heat conduction efficiency. In addition, fans are also common heat dissipation auxiliary components. By accelerating air flow through forced convection, they can significantly increase the heat dissipation speed and ensure that heat can be taken away in time when the electronic equipment is running at high load.
The use of special plastic materials or surface treatment technologies can also help improve heat dissipation performance. Some new plastic materials can improve their thermal conductivity to a certain extent by adding special thermal conductive fillers, such as metal powders and carbon nanotubes. Although its thermal conductivity is still not as good as that of metal, it has been significantly improved compared to ordinary plastics. In addition, surface treatment of the shell can also play a role in assisting heat dissipation. For example, spraying a coating with high emissivity on the surface of the shell can enhance the shell's ability to radiate heat to the outside world, allowing the heat to be dissipated faster in the form of thermal radiation, thereby reducing the temperature inside the shell.
Reasonable planning of the layout of components inside electronic equipment and cooperation with the heat dissipation design of the shell are also the key to meeting high heating requirements. When customizing the shell, according to the heating conditions of each component of the electronic equipment, the components with high heat generation will be arranged near the heat dissipation holes or heat sinks to shorten the heat transfer path. At the same time, avoid placing multiple heating components in a centralized manner to prevent excessive local heat. By optimizing the layout of components, the heat can be distributed more evenly and quickly transferred to the heat dissipation structure of the shell to improve the overall heat dissipation effect.
The introduction of the intelligent temperature control system has brought new breakthroughs in heat dissipation design. A temperature sensor is installed in the non-standard customized plastic shell to monitor the internal temperature in real time. When the temperature reaches the preset threshold, the intelligent temperature control system will automatically start the cooling fan or adjust the working state of the heat sink, such as auxiliary cooling of the heat sink through a semiconductor refrigeration sheet. When the temperature drops to a certain level, the system will automatically reduce the heat dissipation measures to avoid unnecessary energy consumption. This intelligent control method can not only ensure the stable operation of electronic equipment under high heating conditions, but also achieve the purpose of energy saving.
In the production process of non-standard customized plastic shell, strict control of process quality is crucial to heat dissipation performance. From mold design to injection molding, each link requires precise control. High-quality molds can ensure the dimensional accuracy of the shell, so that the heat dissipation holes, air ducts and other structures meet the design requirements and ensure smooth air circulation. A good injection molding process can avoid defects such as bubbles and shrinkage marks on the shell, preventing these defects from affecting the strength and heat dissipation effect of the shell. Only through strict quality control can a plastic shell that meets the heat dissipation design requirements be produced to provide reliable heat dissipation guarantee for electronic equipment.
